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Silicon to Silicon Wafer Bonding at Low Temperature Using Residual Stress Controlled Evaporated Glass Thin Film

Author(s):
Publication title:
Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China
Title of ser.:
Materials science forum
Ser. no.:
510-511
Pub. date:
2006
Page(from):
1054
Page(to):
1057
Pages:
4
Pub. info.:
Uetikon-Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499953 [0878499954]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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