Via/Hole Filling by Pulse-Reverse Copper Electroplating for 3D SiP

Via/Hole Filling by Pulse-Reverse Copper Electroplating for 3D SiP

Author(s):

Publication title:

Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China

Title of ser.:

Materials science forum

Ser. no.:

510-511

Pub. Year:

2006

Page(from):

942

Page(to):

945

Pages:

4

Pub. info.:

Uetikon-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499953 [0878499954]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00015820
Series ID:	PA00000012
Conf. info. (Name):	International Symposium on Eco-materials Processing & Design
Conf. info. (Number):	7th
Conf. info. (Venue):	Chengdu, China
Conf. info. (Date):	2006.01.08-2006.01.11

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