Low-Temperature PETEOS-to-PETEOS Wafer Bonding Using Titanium as Bonding Intermediate
- Author(s):
Yu, Jian Moore, Richard L. Lee, Sang Hwui McMahon, J. Jay Lu, Jian-Qiang Gutmann, Ronald J. - Publication title:
- Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 914
- Pub. Year:
- 2006
- Page(from):
- 427
- Page(to):
- 432
- Pages:
- 6
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558998705 [1558998705]
- Language:
- English
- Call no.:
- M23500/914
- Type:
- Conference Proceedings
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