Blank Cover Image

Thermal and Electromigration-Induced Strains in Copper Conductor Lines: X-Ray Microbeam Measurements and Analysis

Author(s):
Wang, G.
Zhang, H.
Cargill III, G.S.
Hu, C.-K.
Ge, Y.
Maniatty, A.
1 more
Publication title:
Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
914
Pub. Year:
2006
Page(from):
325
Page(to):
330
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998705 [1558998705]
Language:
English
Call no.:
M23500/914
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings In Situ X-ray Microbeam Cu Fluorescence and Strain Measurements on Al(0.5 at.% Cu) Conductor Lines During Electromigration

Kao, H-K., Cargill, G. S., III., Hwang, K. J., Ho, A. C., Wang, P-C., Hu, C-K.

MRS - Materials Research Society
7 Conference Proceedings Concentration And Stress Evolution During Electromigration In Passivated Al(0.25 at. % Cu) Conductor Lines

Kao, H., Cargill III, G., Hu, C.

Materials Research Society
2 Conference Proceedings Thermal and Electromigration Strain Distributions in 10-ｦﾌm-Wide Aluminum Conductor Lines Measured by X-ray Microdiffraction

Wang, P-C., Cargill, G. S., III., Noyan, I. C., Liniger, E. G., Hu, C-K., Lee, K. Y.

MRS - Materials Research Society
8 Conference Proceedings STRAIN MEASUREMENTS AND LAUE DIFFRACTION WITH MICROBEAMS

Wang, P. -C., Cargill, G. S., III, Noyan, I. C.

MRS - Materials Research Society
3 Conference Proceedings X-ray Microbeam Studies of Electromigration

Cargill, G. S., III., Ho, A. C., Hwang, K. J., Kao, H. K., Wang, P-C., Hu, C-K.

MRS - Materials Research Society
9 Conference Proceedings Simulations and experiments on capillary optics for x-ray microbeams

G.S. Cargill Ⅲ, K. Hwang, J.W. Lam, P.C. Wang, E. Liniger

Society of Photo-optical Instrumentation Engineers
4 Conference Proceedings X-ray Microbeam Diffraction Measurements in Polycrystalline Aluminum and Copper Thin Films

Moyer, L.E., Cargill, G.S. III, Yang, W., Larson, B.C., Ice, G.E.

Materials Research Society
10 Conference Proceedings X-Ray Microbeam Strain Measurements in Polycrystalline Films

Gray III, G.T., Moyer, L., Yang, W., Larson, B.C., Ice, G.E.

Trans Tech Publications
5 Conference Proceedings Electrical Resistance Anomalies During Electromigration Testing of Cu Conductor Lines: Examples of Local Melting?

Zhang, Hongqing, Wang, Gan, Cargill III, G.S.

Materials Research Society
11 Conference Proceedings X-ray Microdiffraction for VLSI

Wang, P.-C., Cargill, G. S., III, Noyan, I. C., Liniger, E. G., Hu, C.-K., Lee, K. Y.

MRS - Materials Research Society
6 Conference Proceedings Strain Measurements From Single Grains In Passivated Aluminum Conductor Lines by X-ray Microdiffraction During Electromigration

Hwang, K.J., Cargill III, S.G., Marieb, T.

Materials Research Society
12 Conference Proceedings Electromigration in Epitaxial Copper Lines

Goindi, H.S., Shin, C.S., Frederick, M., Shusterman, Y., Kim, H., Petrov, I., Ramanath, G.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12