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Scalling of Statistical and Physical Electromigration Characteristics in Cu Interconnects

Author(s):
Gall, Martin
Hauschildt, Meike
Justison, Patrick
Ramakrishna, Konero
Hernandez, Richard
Herrick Matthew
Michaelson Lynne
Kawasaki, Hisao
3 more
Publication title:
Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
914
Pub. Year:
2006
Page(from):
305
Page(to):
316
Pages:
12
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998705 [1558998705]
Language:
English
Call no.:
M23500/914
Type:
Conference Proceedings

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