Aqueous Based Single Wafer Cleaning Process Development and Integration Into 65 nm Process Flow Using Metal Hard Mask

Aqueous Based Single Wafer Cleaning Process Development and Integration Into 65 nm Process Flow Using Metal Hard Mask

Author(s):

Lin, Miao-Chun

Publication title:

Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

914

Pub. Year:

2006

Page(from):

287

Page(to):

294

Pages:

8

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558998705 [1558998705]

Language:

English

Call no.:

M23500/914

Type:

Conference Proceedings

Details

TDL ID:	ZA00015794
Series ID:	PA00000011
Conf. info. (Name):	Symposium on materials, technology and reliability of low-k dielectrics and copper interconnects
Conf. info. (Number):	2006
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2006.04.18-2006.04.21

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