PLANARIZED COPPER INTERCONNECTS BY SELECTIVE ELECTROLESS PLATING

PLANARIZED COPPER INTERCONNECTS BY SELECTIVE ELECTROLESS PLATING

Author(s):

Kiang, M.H.

Publication title:

Materials reliability in microelectronics II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

265

Pub. Year:

1992

Page(from):

187

Page(to):

198

Pages:

12

Pub. info.:

Pittsburgh, PA: Materials Research Society

ISSN:

02729172

ISBN:

9781558991606 [1558991603]

Language:

English

Call no.:

M23500/265

Type:

Conference Proceedings

Details

TDL ID:	ZA00015749
Series ID:	PA00000011
Conf. info. (Name):	Symposium on materials reliability in microelectronics
Conf. info. (Number):	2nd
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1992.04.27-1992.05.01

Similar Items:

1 Conference Proceedings PLANARIZED COPPER INTERCONNECTS BY SELECTIVE ELECTROLESS PLATING Kiang, M. H., Tao, J.,, Namgoong, W., Hu, C, Lieberman, M., Cheung, N. W., Kang, H.-K., Wong. S. S. Materials Research Society	7 Conference Proceedings Microtexture And Strain In Electroplated Copper Interconnects Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., … Materials Research Society
2 Conference Proceedings SELECTIVE COPPER PLATING IN SILICON DIOXIDE TRENCHES WITH METAL PLASMA IMMERSION ION IMPLANTATION Kiang, Meng-Hsiung, Pico, Carey A., Lieberman, Michael A., Cheung, Nathan W., Qian, X. Y., Yu, K. M. Materials Research Society	8 Conference Proceedings Microtexture and Strain in Electroplated Copper Interconnects Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., … Materials Research Society
3 Conference Proceedings Selectively deposited copper on laser-treated polyimide using electroless plating Zhao,G., Phillips,H.M., Zheng,H., Tam,S.-C., Liu,W., Wen,G., Gong,Z., Lam,Y.-L. SPIE - The International Society for Optical Engineering	9 Conference Proceedings Reconditioning of Electroless Nickel Plating Bath on Magnesium Alloys X.K. Liu, P. Liu, Y.H. Xiang, W.B. Hu, W.J. Ding Trans Tech Publications
4 Conference Proceedings *ELECTROLESS COPPER DEPOSITION FOR MULTILEVEL METALLIZATION Wong, S. Simon, Cho, James S., Kang, Ho K., Ting, C.H. Materials Research Society	10 Conference Proceedings The Control of Topographical Selectivity in Pd-Activated Electroless Copper Deposition Oh, Y.-J., Cho, S.M., Chung, C.-H. Electrochemical Society
5 Conference Proceedings Fabrication of micro-conductive patterns using laser ablation and selective electroless Ni-B plating Kang, H. -S., Kim, H. -W., Hong, S. -K., Lee, J. H., Shin, D. S., Kang, S. G. SPIE - The International Society of Optical Engineering	11 Conference Proceedings Ni Nanoparticles Deposition onto CNTs by Electroless Plating G.S. Cho, J.K. Lim, K.H. Choe, W.S. Lee Trans Tech Publications
6 Conference Proceedings Copper Electroplating for Damascene ULSI Interconnects Dubin, V. M., Lopatin, S., Chen, S., Cheung, R., Ryu, C., Wong, S. S. MRS - Materials Research Society	12 Conference Proceedings Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application Kim, D.G., Bae, J.S., Lee, J.H., Kim, Y.D., Ahn, Y.M. Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12