Blank Cover Image

QUICK TESTS FOR ELECTROMIGRATION : USEFUL BUT NOT WITHOUT DANGER

Author(s):
Lloyd, J. R  
Publication title:
Materials reliability in microelectronics II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
265
Pub. Year:
1992
Page(from):
177
Page(to):
186
Pages:
10
Pub. info.:
Pittsburgh, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558991606 [1558991603]
Language:
English
Call no.:
M23500/265
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings QUICK TESTS FOR ELECTROMIGRATION: USEFUL BUT NOT WITHOUT DANGER

Lloyd, J. R.

Materials Research Society
7 Conference Proceedings Electromigration-Induced Failure as a Function of Via Interface

Kisselgof, Larisa, Lloyd, J. R.

MRS - Materials Research Society
2 Conference Proceedings Stress and Electromigration

Lloyd, J. R.

MRS - Materials Research Society
8 Conference Proceedings ELECTROMIGRATION INDUCED RESISTANCE CHANGES IN PASSIVATED ALUMINUM THIN FILM CONDUCTORS

Mockl, U. E., Lloyd, J. R., Arzt, E.

MRS - Materials Research Society
3 Conference Proceedings MECHANICAL STRESS AND ELECTROMIGRATION FAILURE

Lloyd, J. R.

Materials Research Society
9 Conference Proceedings Aluminofluoride Complexes: A Useful Tool in Laboratory Investigations, but a Hidden Danger for Living Organisms?

Strunecka, Anna, Patocka, Jiri

American Chemical Society
4 Conference Proceedings THE FINITE ELECTROMIGRATION BOUNDARY VALUE PROBLEM

Lloyd, J. R., Kitchin, J.

MRS - Materials Research Society
10 Conference Proceedings The Role of Metal and Passivation Defects in Electromigration-Induced Damage in Thin Film Conductors

Lloyd, J. R., Smith, P. M., Prokop, G. S.

North-Holland
5 Conference Proceedings *ELECTROMIGRATION FAILURE AND MECHANICAL STRESS IN THIN FILM CONDUCTORS

Lloyd, J. R.

Materials Research Society
11 Conference Proceedings ELECTROMIGRATION LIFETIME AND STEP COVERAGE IN Al/Cu/Si THIN FILM CONDUCTORS

Kisselgof, Larisa, Elliott, L. J., Maziarz, J. J., Lloyd, J. R.

Materials Research Society
6 Conference Proceedings 30 Years of Electromigration Research: A Grand Masters' Perspective

Lloyd, J. R.

MRS - Materials Research Society
12 Conference Proceedings The Effect of a Threshold Failure Time on Electromigration Behavior of Copper Interconnects

R.G. Filippi, J. Lloyd, P. Wang, A. Brendler, J. Poulin

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12