PROCESS DEPENDENCE OF MICROSTRUCTURE AND PROPERTIES OF SINTERED ALUMINUM NITRIDE FOR ELECTRONIC PACKAGING

PROCESS DEPENDENCE OF MICROSTRUCTURE AND PROPERTIES OF SINTERED ALUMINUM NITRIDE FOR ELECTRONIC PACKAGING

Author(s):

Publication title:

Electronic packaging materials science VI : symposium held April 27-30, 1992, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

264

Pub. Year:

1992

Page(from):

395

Page(to):

400

Pages:

6

Pub. info.:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558991699 [1558991697]

Language:

English

Call no.:

M23500/264

Type:

Conference Proceedings

Details

TDL ID:	ZA00015748
Series ID:	PA00000011
Conf. info. (Name):	Symposium on electronic packaging materials science
Conf. info. (Number):	6th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1992.04.27-1992.04.30

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