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X-RAY DETERMINATION OF RESIDUAL STRESSES OF ENCAPSULATED THIN ALUMINUM LINES

Author(s):
Publication title:
Electronic packaging materials science VI : symposium held April 27-30, 1992, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
264
Pub. Year:
1992
Page(from):
243
Page(to):
250
Pages:
8
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991699 [1558991697]
Language:
English
Call no.:
M23500/264
Type:
Conference Proceedings

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