PLANARIZED COPPER INTERCONNECTS BY SELECTIVE ELECTROLESS PLATING
- Author(s):
Kiang, M. H. Tao, J., Namgoong, W. Hu, C Lieberman, M. Cheung, N. W. Kang, H.-K. Wong. S. S. - Publication title:
- Advanced metallization and processing for semiconductor devices and circuits--II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 260
- Pub. Year:
- 1992
- Page(from):
- 745
- Page(to):
- 756
- Pages:
- 12
- Pub. info.:
- Pittsburgh, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558991552 [1558991557]
- Language:
- English
- Call no.:
- M23500/260
- Type:
- Conference Proceedings
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