Blank Cover Image

GROWTH OF EPITAXIAL SILICON CARBIDE ON SILICON BY RAPID THERMAL LPCVD

Author(s):
Publication title:
Rapid thermal and integrated processing : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
224
Pub. Year:
1991
Page(from):
241
Page(to):
246
Pages:
6
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991187 [1558991182]
Language:
English
Call no.:
M23500/224
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings LOW TEMPERATURE EPITAXIAL SILICON GROWTH IN A RAPID THERMAL PROCESSOR

McNeill, D. W., Gamble, H. S., Armstrong, B. M.

Materials Research Society
7 Conference Proceedings Electrical and Structural Characterization of Silicon on Silicon Bonded Interfaces

McCann, P., MeKeever, J., Nicholson, D., Ruddell, F., Gamble, H.S., Nevin, W.A.

Electrochemical Society
2 Conference Proceedings LARGE-GRAIN POLYSILICON FILMS DEPOSITED BY RAPID THERMAL LPCVD

Mitchell, S. J. N., McNeil, D. W., Raza, S. H., Armstrong, B. M., Gamble, H. S.

Materials Research Society
8 Conference Proceedings Encroachment on Silicon Substrate by PECVD Deposited Tungsten at Low Temperatures and the Effect of WF5 on Selectivity

Bain, M.F., Armstrong., B.M., Gamble, H.S.

Electrochemical Society
3 Conference Proceedings CARBON DOPED SILICON EMITTERS FABRICATED USING LIMITED REACTION PROCESSING

Ruddell, F. H, Armstrong, B. M., Gamble, H, S., Affolter, K. B., Moynagh, P. B., Rosserm P. J.

Materials Research Society
9 Conference Proceedings Fabrication of sub-micron active layer SSOI substrates using ion splitting and wafer bonding technologies

Ruddell, F.H., Rain, M.F., Suder, S., Hurley, R.E., Armstrong, R.M., Fusco, V.F., Gamble, H.S.

Electrochemical Society
4 Conference Proceedings Fabrication of Sub-micron Active Layer SSOI Substrates using Ion Splitting And Wafer Bonding Technologies

Ruddell, F., Bain, M., Suder, S., Hurley, R.E., Armstrong, B.M., Fusco, V.F., Gamble, H.S.

Electrochemical Society
10 Conference Proceedings Characteristics and Applications of Silicon Direct Bonded Interfaces

McCann, P., Devine, C., Ruddell, F., Baine, P., Gamble, H.S., Nevin, W.A.

Electrochemical Society
5 Conference Proceedings GROWTH OF MULTI-LAYER Si/Si1-xGex STRUCTURES USING RAPID THERMAL CHEMICAL VAPOUR DEPOSITION

McNeill, David W., Armstrong, B. Marvyn, Gamble, Harold S.

MRS - Materials Research Society
11 Conference Proceedings CHARACTERIZATION OF LPCVD OF SILICON NITRIDE IN A RAPID THERMAL PROCESSOR

Johnson, Scott F., Miller, Roderick M., Ozturk, Mehmet C., Worman, Jimmie, J.

Materials Research Society
6 Conference Proceedings Fabrication and characterisation of Silicon On Insulator substrates incorporating thermal vias.

Bain, M.F., Baine, P., McNeill, D.W., Srinivasan, G., Jankovic, N., McCartney, J., Moore, R.A., Armstrong, B.M., Gamble, …

Kluwer Academic Publishers
12 Conference Proceedings Investigation of the Electrical Properties of Bonded Silicon-on-Isolator Wafers

Bailey, P.T, Jin, G., Armstrong, B.M., Gamble, H.S.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12