MECHANICAL CHARACTERISTICS OF In AND Pb5Sn SOLDERS IN A THIN FILM MULTICHIP PACKAGE

MECHANICAL CHARACTERISTICS OF In AND Pb5Sn SOLDERS IN A THIN FILM MULTICHIP PACKAGE

Author(s):

Publication title:

Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

203

Pub. Year:

1991

Page(from):

443

Page(to):

448

Pages:

6

Pub. info.:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558990951 [155899095X]

Language:

English

Call no.:

M23500/203

Type:

Conference Proceedings

Details

TDL ID:	ZA00015687
Series ID:	PA00000011
Conf. info. (Name):	Symposium on electronic packaging materials science
Conf. info. (Number):	5th
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1990.11.26-1990.11.29

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