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INTERFACIAL FAILURE IN Ti/SiO2 AND Ti/AIN SYSTEMS AND TEMPERATURE DEPENDENCE OF HARDNESS OF AIN

Author(s):
Publication title:
Advanced electronic packaging materials : symposium held November 27-29, 1989, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
167
Pub. Year:
1990
Page(from):
301
Page(to):
308
Pages:
8
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558990555 [1558990550]
Language:
English
Call no.:
M23500/167
Type:
Conference Proceedings

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