*CERAMICS IN MICROELECTRONICS PACKAGING: PAST, PRESENT AND FUTURE

*CERAMICS IN MICROELECTRONICS PACKAGING: PAST, PRESENT AND FUTURE

Author(s):: Tummala, Rao R.
Publication title:: Electronic packaging materials science IV : symposium held April 24-28, 1989, San Diego, California, U.S.A.
Title of ser.:: Materials Research Society symposium proceedings
Ser. no.:: 154
Pub. Year:: 1989
Page(from):: 379
Page(to):: 386
Pages:: 8
Pub. info.:: Pittsburgh, Pa.: Materials Research Society
ISSN:: 02729172
ISBN:: 9781558990272 [1558990275]
Language:: English
Call no.:: M23500/154
Type:: Conference Proceedings

Details

TDL ID:	ZA00015638
Series ID:	PA00000011
Conf. info. (Name):	Symposium on electronic packaging materials science
Conf. info. (Number):	4th
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	1989.04.24-1989.04.28

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