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OXYGEN REACTIVE ION BEAM ETCHING ON POLYIMIDE TO ENHANCE COPPER FILM ADHESION

Author(s):
Publication title:
Adhesion in solids : symposium held April 5-7, 1988, Reno, Nevada, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
119
Pub. Year:
1988
Page(from):
271
Page(to):
276
Pages:
6
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9780931837968 [0931837960]
Language:
English
Call no.:
M23500/119
Type:
Conference Proceedings

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