Blank Cover Image

THERMAL STABILITY OF AMORPHOUS Ni-Nb THIN FILMS FOR USE AS DIFFUSION BARRIERS

Author(s):
Publication title:
Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
108
Pub. Year:
1988
Page(from):
47
Page(to):
50
Pages:
4
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9780931837760 [0931837766]
Language:
English
Call no.:
M23500/108
Type:
Conference Proceedings

Similar Items:

Farrens, S. N., Perepezko, J. H.

Materials Research Society

Kim,Y.T., Kim,D.J., Lee,C.W., Park,J.-W.

SPIE-The International Society for Optical Engineering

Dobisz, E.A., Craighead, H.G., Perepezko, J.H., Wiley, J.D., Doyle, B.L., Peercy, P.S.

Materials Research Society

Cardinale, Gregory F., Farrens, S. N., Howitt, D. G.

Materials Research Society

Doyle, B. L., Peercy, P. S., Thomas, R. E., Perespezko, J. H, Wiley, J. D.

North-Holland

Chang, J. P., Krautter, H. W., Opila, R. L., Pal, C. S., Zhu, W.

Materials Research Society

Dobisz, E. A., Doyle, B. L., Perepezko, J. H., Wiley, J. D., Peercy, P. S.

Materials Research Society

Deane, S. C., French, I. D., Hewett, J., Powell, M. J., Wehrspohn, R. B.

Materials Research Society

R. Chmielewski, S. J. Thorpe

Electrochemical Society

N.T.H. Oanh, P.P. Choi, J.S. Kim, D.H. Kwon, Y.S. Kwon

Trans Tech Publications

Dong, Z. F., Perepezko, J. H., Edelstein, A. S.

MRS-Materials Research Society

Perepezko, J.H., Wu, R.I., Herbert, R., Wilde, G.

Materials Research Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12