Blank Cover Image

PREDICTIVE DESIGN OF MULTICOMPONENT POLYMERS FOR PRINTED CIRCUIT BOARDS

Author(s):
Publication title:
Electronic packaging materials science II : symposium held April 15-18 1986, Palo Alto, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
72
Pub. Year:
1986
Page(from):
223
Page(to):
234
Pages:
12
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9780931837388 [0931837383]
Language:
English
Call no.:
M23500/72
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings AC IMPEDANCE ANALYSIS OF RESIDUES ON PRINTED CIRCUIT BOARDS

White, J.R.

Electrochemical Society
7 Conference Proceedings The Corrosive Effect of Soldering Fluxes on Printed Circuit Boards

Galvan, J.C., Bastidas, J.M., Felliu, S.

Electrochemical Society
2 Conference Proceedings Optical measurement of solder bonds on printed circuit boards

J.D. Pearson, F. Lilley, J.T. Atkinson, D.R. Burton, A.J. Goodall

Society of Photo-optical Instrumentation Engineers
8 Conference Proceedings Determining Etch Compensation Factors for Printed Circuit Boards

DeRose, A., Theriault, R. P., Osswald, T. A., Castro, J. M.

Society of Plastics Engineers, Inc. (SPE)
3 Conference Proceedings Parallel optical interconnects in printed circuit boards [5990A-14]

Offein, B. J., Berger, C., Beyeler, R., Dangel, R., Dellmann, L., Horst, F., Lamprecht, T., Meier, N., Budd, R., Libsch, …

SPIE - The International Society of Optical Engineering
9 Conference Proceedings Polymers for electrical connections in printed circuit boards (Invited Paper) [6347-66]

Kisiel, R.

SPIE - The International Society of Optical Engineering
4 Conference Proceedings Coupling paths in multilayer printed circuit boards for electromagnetic interference and immunity: experiments and FDTD modeling

Cui,W., Berg,D.P., Drewniak,J.L., DuBroff,R.E.

SPIE-The International Society for Optical Engineering
10 Conference Proceedings Towards flexible routing schemes for polymer optical interconnections on printed circuit boards

N. Hendrickx, G. Van Steenberge, E. Bosman, J. Van Erps, H. Thienpont

Society of Photo-optical Instrumentation Engineers
5 Conference Proceedings Design and analysis of 3D stacked optoelectronics on optical printed circuit boards

J. H. Lau, Y. Y. Lim, T. G. Lim, G. Y. Tang, C. H. Khong

Society of Photo-optical Instrumentation Engineers
11 Conference Proceedings A new unique electrostatic imager for nondestructive evaluation of printed circuit boards

Zentai, G., Partain, L.D., Proano, C., Yamaoka, S.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings UV curable solder resists for printed circuit boards

Fisher, L. J.

Society of Plastics Engineers, Inc. (SPE)
12 Conference Proceedings Acoustically induced vibration of platform-mounted equipment containing printed-circuit boards

Pinder, J.N., Eaton, D. C. G.

ESA Publications Division
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12