Blank Cover Image

REACTION KINETICS, STRESS AND MICROSTRUCTURE IN TITANIUM-COPPER-TITANIUM THIN FILMS

Author(s):
Publication title:
Thin films : interfaces and phenomena : symposium held December 2-6, 1985, Boston, Massachusetts, USA
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
54
Pub. Year:
1985
Page(from):
153
Page(to):
158
Pages:
6
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9780931837197 [0931837197]
Language:
English
Call no.:
M23500/54
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings EFFECTS OF HYDROGEN ON THERMAL STRESS IN LAYERED STRUCTURE OF Ti AND Ti (Al) THIN FILMS

Hu,C.-K., Ho, P.S., Gupta, D., Chen, S.T.

Materials Research Society
7 Conference Proceedings Titanium Oxide CVD from Titanium (IV) Nitrate and Titanium (IV) Isopropoxide: Growth Kinetics, Film Morphology and Precursor Specific Effects

Taylor, C.J., Gilmer, D., Gladfelter, W. L., Campbell, S., Roberts, J.T.

Electrochemical Society
2 Conference Proceedings THE MICROSTRUCTURE OF COPPER FILMS DEPOSITED BY E-BEAL EVAPORATION ONTO THIN POLYIMIDE FILMS

Wetzel, J. T., Smith, D. A,., Appleby-Mougham, G.

Materials Research Society
8 Conference Proceedings Effects of seeding over the microstructure and stresses of diamond thin films

Gupta, S., Morell, G., Katiyar, R. S., Gilbert, D. R., Singh, R. K.

MRS-Materials Research Society
3 Conference Proceedings Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

Harper, J. M. E., Cabral, C., Jr., Andricacos, P. C., Gignac, L., Noyan, I. C., Rodbell, K. P., Hu, C. K.

MRS - Materials Research Society
9 Conference Proceedings Stress Voiding and Electromigration Failure in Multilevel Interconnect Metallization

Ho, P.S., Anderson, S.G.H., Yeo, I.S., Hu, C.K.

Electrochemical Society
4 Conference Proceedings Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

Cabral, C., Gignac, L., Harper, J. N. E., Hu, C. K., Noyan, I. C., ricacos, P. C., Rodbell, K. P.

Materials Research Society
10 Conference Proceedings Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films

R. Vayrette, C. Rivero, S. Blayac, K. Inal

Trans Tech Publications
5 Conference Proceedings MICROSTRUCTURE AND KINETICS OF THE INTERFACE REACTION BETWEEN TITANIUM THIN FILMS AND (112) SAPPHIRE SUBSTRATES

Selverian, J.H., Ohuchi, F.S., Notis, M.R.

Materials Research Society
11 Conference Proceedings Characterisation of the Oxidation Kinetics of Thin, Low Temperature, Electroless Plated Copper Films

Beechinor, J. T., O'Reilly, M., Patterson, J. C., Lynch, S., Lafferty, E., Kelly, P. V., Crean, G. M.

MRS - Materials Research Society
6 Conference Proceedings Stress, Microstructure And Temperature Stability Of Reactive Sputter Deposited WNx Thin Films

Leedy, K.D., O'Keefe, M.J., Wilson, J.G., Osterday, R., Grant, J.T.

Materials Research Society
12 Conference Proceedings A Three-Phase Model For The Structure Of Porous Thin Films Determined By X-ray Reflectivity And Small-Angle Neutron Scattering

Wu, W., Lin, E.K., Jin, C., Wetzel, J.T.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12