Blank Cover Image

Cross-Sectional Crystallographic Analysis of Copper Electrodeposits for ULSI Metallization by EBSD

Author(s):
Publication title:
Electrochemical processes in ULSI and MEMS : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2004-17
Pub. Year:
2005
Page(from):
108
Page(to):
116
Pages:
9
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774727 [1566774721]
Language:
English
Call no.:
E23400/200417
Type:
Conference Proceedings

Similar Items:

Cho, J.-H., Cho, J.S., Moon, J.T., Lee, J., Cho, Y.H., Rollett, A.D., Oh, K.H.

Trans Tech Publications

Kim, D.-I., Paik, J.-M., Joo, Y.-C., Oh, K.H., Lee, H.-C., Dicks, K.

Trans Tech Publications

Kang, S.Y., Lee, D.N.

Trans Tech Publications

Kim, D.-I., Lee, J.-H., Kim, Y.-W., Oh, K.H., Lee, H.-C.

Trans Tech Publications

9 Conference Proceedings Texture Analysis of Copper Bonding Wire

Baeck, S.M., Park, K.K., Ha, H., Oh, Y., Park, Y., Moon, J.T., Lee, J., Oh, K.H.

Trans Tech Publications

Y.M. Koo, K.H. Oh, D.N. Lee

Trans Tech Publications

K.H. Oh, Y.M. Koo, D.N. Lee

Trans Tech Publications

Shin, H.-J., Lee, D.N.

Trans Tech Publications

Lee, D. N.

MRS - Materials Research Society

Jeong,H-T., Lee,D.N., Oh,K.H.

Trans Tech Publications

J.K. Sung, D.N. Lee

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12