Blank Cover Image

WAFER BACKSIDE METALLIC DECONTAMINATION CONTROL FOR FEOL PROCESSING

Author(s):
Xu, K. 1,2
KRAUS, H. 1
Vos, R. 2
HELLIN, D. 2
RIP, J. 2
SNOW, J. 2
MERTENS, P. W. 2
ARCHER, L. 1
WAGNER, G. 1
KOVACS, F. 1
5 more
Publication title:
Semiconductor technology (ISTC 2006) : proceedings of the 5th International Conference on Semiconductor Technology
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2006-03
Pub. Year:
2006
Page(from):
150
Page(to):
158
Pages:
9
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774376 [1566774373]
Language:
English
Call no.:
E23400/200603
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings SELECTIVE ETCHING OF SiGe FOR REMOVAL OF DUMMY LAYERS IN FULLY SILICIDED GATE ARCHITECTURES

J. Snow, R. Vos, K. G. Anil, H. Kraus, K. Xu, F. Grinninger, G. Wagner, F. Kovacs, P. W. Mertens

Electrochemical Society
7 Conference Proceedings REDUCTION OF SURFACE METALLIC CONTAMINATION THROUGH OPTIMIZED RINSING AND SINGLE-WAFER DRYING

Fyen, W., Holsteyns, F., Lauerhaas, J., Bearda, T., Mertens, P., Heyns, M.

Electrochemical Society
2 Conference Proceedings Post Salicidation Clean: Selective Removal of Un-Reacted NiPt Towards NiPtSi(Ge)

K. Xu, A. Lauwers, R. Vos, L. Archer, H. Kraus

Electrochemical Society
8 Conference Proceedings SUB 1OOnm PARTICLE REMOVAL WITH DEIONIZED WATER AND A MEGASONIC FREQUENCY OF 835kHz

Lauerhaas, J., Wu, Y., Xu, K., Vereecke, G., Vos, R., Kenis, K., Mertens, P., Nicolosi, T., Heyns, M.

Electrochemical Society
3 Conference Proceedings SELECTIVE REMOVAL OF Ni FOR SALICIDATION AND FULLY SILICIDED GATES

K. Kraus, V. Fano Leston, J. Snow, K. Xu, M. de Potter de ten Broeck, A. Lauwers, P. W. Mertens, F. Kovacs

Electrochemical Society
9 Conference Proceedings Examination of total reflection x-ray fluorescence spectroscopy (TXRF) as a tool for contamination control and selection of appropriate values of important …

Hellin

Electrochemical Society
4 Conference Proceedings CLEANING OF METAL GATE STACKS FOR THE SUB 90 nm TECHNOLOGY NODE

Snow, J., Kraus, H., Vermeyen, K., Fyen, W., Mertens, P., Kovacs, F.

Electrochemical Society
10 Conference Proceedings A New Approach for FEOL Critical Wafer Surface Cleaning

T. Fischer, S. Puri, R. Hoyer, K.L. Wostyn, T. Janssens

Electrochemical Society
5 Conference Proceedings INVITED: WAFER CLEANING: A QUANTIFIABLE PROCESS STEP

Mertens, P.W., Loewenstein, L., Vos, R., De Gendt, S., Bearda, T., Heynes, M.M.

Electrochemical Society
11 Conference Proceedings MECHANISMS OF PARTICLE REMOVAL DURING BRUSH SCRUBBER CLEANING

Xu, K., Vos, R., Vereecke, G., Mertens, P., Heyns, M., Vinckier, C., Fransaer, J.

Electrochemical Society
6 Conference Proceedings The Effect of Delay Between Dry Etch and Wet Clean Processing Steps on Cleaning of Post-Etch Residues

D. Hellin, I.J. Vos, G. Vereecke, E. Pavel, W. Boullart

Electrochemical Society
12 Conference Proceedings Resist model calibration using 2D developed patterns for low-k1 process optimization and wafer printing predictions

Chen, T., Van Den Broeke, D., Park, S., Liebchen, A., Chen, J. F., Hsu, S., Park, J. C., Yu, L., Gronlund, K.

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12