INITIAL SURFACE ROUGHNESS OF ELECTROCHEMICAL PLATING COPPER UNDEI DIFFERENT CONDITIONS

INITIAL SURFACE ROUGHNESS OF ELECTROCHEMICAL PLATING COPPER UNDEI DIFFERENT CONDITIONS

Author(s):

SUN, QlNG-QlNG

Publication title:

Semiconductor technology (ISTC 2006) : proceedings of the 5th International Conference on Semiconductor Technology

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2006-03

Pub. Year:

2006

Page(from):

54

Page(to):

58

Pages:

5

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774376 [1566774373]

Language:

English

Call no.:

E23400/200603

Type:

Conference Proceedings

Details

TDL ID:	ZA00015408
Series ID:	PA00000028
Conf. info. (Name):	International Conference on Semiconductor Technology
Conf. info. (Number):	5th
Conf. info. (Venue):	Shanghai, China
Conf. info. (Date):	2006.03.21-2006.03.23

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