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(11.4) 4:20 - 4:40 PM - Strained Silicon on Insulator (sSOI) by Wafer Bonding

Author(s):
Christiansen, S.
Reiche, M.
Radu, I.
Singh, R.
Gosele, U.
Webb, D.
Mantl, S. (Max Planck Institute ofMicrostructure Physics)
2 more
Publication title:
SiGe: materials, processing, and devices : proceedings of the First international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2004-07
Pub. Year:
2004
Page(from):
759
Page(to):
768
Pages:
10
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774208 [1566774209]
Language:
English
Call no.:
E23400/200407
Type:
Conference Proceedings

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