Blank Cover Image

Dielectric Adhesive Wafer Bonding for Back-End Wafer-Level 3D Hyper-Integration

Author(s):
Publication title:
Dielectrics for nanosystems: materials science, processing, reliability, and manufacturing : proceedings of the First international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2004-04
Pub. date:
2004
Page(from):
312
Page(to):
323
Pages:
12
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774178 [1566774179]
Language:
English
Call no.:
E23400/200404
Type:
Conference Proceedings

Similar Items:

Lu, J.-Q., Kwon, Y., Jindal, A., McMahon, J.J., Cale, T.S., Gutmann, R.J.

Electrochemical Society

Kwon, Y., Lu, J.-Q., Gutmann, R.J., Kraft, R.P., McDonald, J., Cale, T.S.

Electrochemical Society

Kwon, Y., Lu, J.-Q., Kraft, R.P., McDonald, J.F., Gutmann, R.J., Cale, T.S.

Materials Research Society

Lu, J.-Q., Jindal, A., Kwon, Y., McMahon, J.J., Lee, K-W., Craft, R.P., Altemus, B., Cheng, D., Eisenbraum, E., Cale, …

Electrochemical Society

3 Conference Proceedings Dielectric Glue Wafer Bonding for 3D ICs

Kwon, Y., Jindal, A., McMahon, J. J., Lu, J. -Q., Gutmann, R. J., Cale, T. S.

Materials Research Society

Lu, J. Q., Devarajan, S., Zeng, A. Y., Rose, K., Gutmann, R. J.

Materials Research Society

Lu, J.-Q., Jindal, A., Kwon, Y., McMahon, J.J., Lee, K.-W., Kraft, R.P., Altemus, B., Cheng, D., Eisenbraun, E., Cale, …

Electrochemical Society

Kwon, Y., Jindal, A., McMahon, J.J., Cale, T.S., Gutmann, R.J., Lu, J-Q.

Electrochemical Society

Persans, P.D., Ojha, M., Gutmann, R.J., Lu, J.-Q., Filin, A., Plawsky, J.

Materials Research Society

Jian-Qiang Lu, J. Jay McMahon, Ronald J. Gutmann

Materials Research Society

Lu, J.-Q., Rajagopalan, G., Gupta, M., Cale, T.S., Gutmann, R.J.

Materials Research Society

Jindal, A., Lu, J. -Q., Kwon, Y., Rajagopalan, G., McMahon, J. J., Zeng, A. Y., Flesher, H. K., Cale, T. S., Gutmann, R. …

Materials Research Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12