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CMP Technology for the 32-45 nm Node Cu/Low-k Integration (Invited paper)

Author(s):
Kondo, S.
Yoon, B.U.
Tokitoh, S.
Namiki, A.
Misawa, K.
Inukai, K.
Sone, S.
Shin, H.J.
Matsubara, Y.
Ohashi, N.
Kobayashi, N.
6 more
Publication title:
ULSI Process Integration : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-06
Pub. Year:
2005
Page(from):
385
Page(to):
394
Pages:
10
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774642 [1566774640]
Language:
English
Call no.:
E23400/200506
Type:
Conference Proceedings

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