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Thermal-Microwave Hybrid SOI Materials Technology

Author(s):
Cheng, J.T.
Huang, C.-H.
Hsu, Y.-K.
Chang, C.-L.
Wang, H.-W.
Gan, G.
Lee, S.-L.
Lee, T.-H.
3 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. date:
2005
Page(from):
414
Page(to):
423
Pages:
10
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

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