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Fabrication of SOI Substrates with Buried Silicide Layers for BiCMOS Applications

Author(s):
Wiemer, M.
Zimmermann, S.
Zhao, Q.T.
Trui, B.
Kaufmann, C.
Mantl, S.
Dudek, V.
Gessner, T.
3 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. Year:
2005
Page(from):
303
Page(to):
310
Pages:
8
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

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