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Recent Results on Advanced Molecular Wafer Bonding Technology for 3D Integration on Silicon

Author(s):
di Cioccio, L.
Biasse, B.
Kostrzewa, M.
Zussy, M.
Dechamp, J.
Charlet, B.
Vinet, M.
Fedeli, J.M.
Poiroux, T.
Lagahe-Blanchard, C.
Aspar, B.
Regreny, P.
Kernevez, N.
8 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. date:
2005
Page(from):
280
Page(to):
287
Pages:
8
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

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