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SOI Wafers with Buried Cavities

Author(s):
Suni, T.
Henttinen, K.
Dekker, J.
Luoto, H.
Kulawski, M.
Makinen, J.
Mutikainen, R.
2 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. date:
2005
Page(from):
216
Page(to):
225
Pages:
10
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

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