Blank Cover Image

Wafer Scale Packaging of MEMS by Using Plasma Activated Wafer Bonding

Author(s):
Suni, T.
Henttinen, K.
Lipsainen, A.
Dekker, J.
Luoto, H.
Kulawski, M.
1 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. Year:
2005
Page(from):
173
Page(to):
183
Pages:
11
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings SOI Wafers with Buried Cavities

Suni, T., Henttinen, K., Dekker, J., Luoto, H., Kulawski, M., Makinen, J., Mutikainen, R.

Electrochemical Society
7 Conference Proceedings Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates

Kulawski, Martin, Luoto, Hannu, Henttinen, Kimmo, Suni, Tommi, Weimar, Frauke, Makinen, Jari

Materials Research Society
2 Conference Proceedings Direct Bonding of Thick Film Polysilicon to Glass Substrates

Luoto, H., Suni, T., Henttinen, K., Kulawski, M.

Electrochemical Society
8 Conference Proceedings Advances in the CMP Process on Fixed Abrasive Pads for the Polishing of SOI-Substrates With High Degree of Flatness

Kulawski, Martin, Luoto, Hannu, Henttinen, Kimmo, Suni, Ilkka, Weimar, Franke, Makinen, Jari

Materials Research Society
3 Conference Proceedings Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO2

Suni, T., Henttinen, K., Suni, I., Maekinen, J.

Electrochemical Society
9 Conference Proceedings Wafer Bonding of Plasma Activated Surfaces

T. Plach, V. Dragoi, G. Mittendorfer, M. Wimplinger, K. Hingerl

Electrochemical Society
4 Conference Proceedings Mechanical Delamination for the Materials Integration

Henttinen, K., Suni, T., Nurmela, A., Kulawski, M., Suni, I.

Electrochemical Society
10 Conference Proceedings Characterization of Bonded Interface by HF Etching Method

Suni, T., Kiihamaeki, J., Henttinen, K., Suni, I, Maekinen, J.

Electrochemical Society
5 Conference Proceedings Direct Bonding of Oxidized Cavity Wafers

M.O. Palokangas, J. Dekker, K. Henttinen, J. Mäkinen

Electrochemical Society
11 Conference Proceedings Wafer scale packaging for a MEMS video scanner

Helsel,M.P., Barger,J.D., Wine,D.W., Osborn,T.D.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings Wafer-level scale package of MEMS device by eutectic bonding method

Chen, S., Ma, H., Chen, M., Xiong, T., Liu, S., Yi, X.

SPIE - The International Society of Optical Engineering
12 Conference Proceedings Wafer Bonding for Optical MEMS

Bakke, T., Volker, B., Schenk, H., Radu, I., Reiche, M.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12