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GaN-Based Light-Emitting Diodes for Vertical Current Injection by Laser Lift-off and Wafer Bonding Techniques

Author(s):
Horng, R.-H.
Pan, K.-F.
Lee, C.-E.
Hung, S.-H.
Lin, W.-Y.
Su, Y.-Y.
Yang, C.-C.
Wuu, D.-S.
3 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. date:
2005
Page(from):
140
Page(to):
150
Pages:
11
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

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