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Low Temperature Integration of CdZnTe(211)B/Si(100) by Wafer Bonding

Author(s):
Huang, J.
Cha, D.K.
Kaleczyc, A.
Dinan, J.H.
Carpenter, R.W.
Kim, M.J.
1 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. date:
2005
Page(from):
128
Page(to):
133
Pages:
6
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

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