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Layer Transfer and Characterization of SOI and GeOI Substrates

Author(s):
Liu, Z.X.
Loryuenyoung, V.
Cheung, N.W.
Schmidt, B.
Chen, P.
Lau, S.S.
1 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. Year:
2005
Page(from):
96
Page(to):
105
Pages:
10
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

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