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200 mm Germanium-on-Insulator (GeOI) Structures Realized from Epitaxial Wafers using the Smart CutTM Technology

Author(s):
Deguet, C.
Dechamp, J.
Morales, C.
Charvet, A.M.
Clavelier, L.
Loup V.
Hartmann, J.M.
Kernevez, N.
Campidelli, Y.
Allibert, F.
Richtarche, C.
Akatsu, T.
Letertre, F.
8 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2005-02
Pub. date:
2005
Page(from):
78
Page(to):
88
Pages:
11
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
Language:
English
Call no.:
E23400/200502
Type:
Conference Proceedings

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