Direct Wafer Bonding and Thinning Down: A Generic Technology to Perform New Structures
- Author(s):
- Publication title:
- Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2005-02
- Pub. Year:
- 2005
- Page(from):
- 64
- Page(to):
- 77
- Pages:
- 14
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774604 [1566774608]
- Language:
- English
- Call no.:
- E23400/200502
- Type:
- Conference Proceedings
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