Transient electro-thermal investigations of interconnect structures exposed to mechanical stress

Author(s):

Holzer, S. ( Technical Univ. of Vienna (Austria) )

Hoilauer, C. ( Technical Univ. of Vienna (Austria) )

Ceric, H. ( Technical Univ. of Vienna (Austria) )

Wagner, S. ( Technical Univ. of Vienna (Austria) )

Langer, E. ( Technical Univ. of Vienna (Austria) )

Grasser, T. ( Technical Univ. of Vienna (Austria) )

Selberherr, S. ( Technical Univ. of Vienna (Austria) )

2 more

Publication title:

VLSI Circuits and Systems II

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5837

Pub. Year:

2005

Page(from):

380

Page(to):

387

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819458322 [0819458325]

Language:

English

Call no.:

P63600/5837-1

Type:

Conference Proceedings