Transient electro-thermal investigations of interconnect structures exposed to mechanical stress
- Author(s):
Holzer, S. ( Technical Univ. of Vienna (Austria) ) Hoilauer, C. ( Technical Univ. of Vienna (Austria) ) Ceric, H. ( Technical Univ. of Vienna (Austria) ) Wagner, S. ( Technical Univ. of Vienna (Austria) ) Langer, E. ( Technical Univ. of Vienna (Austria) ) Grasser, T. ( Technical Univ. of Vienna (Austria) ) Selberherr, S. ( Technical Univ. of Vienna (Austria) ) - Publication title:
- VLSI Circuits and Systems II
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5837
- Pub. Year:
- 2005
- Page(from):
- 380
- Page(to):
- 387
- Pages:
- 8
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819458322 [0819458325]
- Language:
- English
- Call no.:
- P63600/5837-1
- Type:
- Conference Proceedings
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