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Wafer level optoelectronic device packaging using MEMS (Invited Paper)

Author(s):
  • Nallani, A. ( Univ. of Texas at Dallas (USA) and MicroFab Technologies, Inc. (USA) )
  • Chen, T. ( MicroFab Technologies, Inc. (USA) )
  • Lee, J.-B. ( Univ. of Texas at Dallas (USA) )
  • Hayes, D. ( MicroFab Technologies, Inc. (USA) )
  • Wallace, D. ( MicroFab Technologies, Inc. (USA) )
Publication title:
Smart sensors, actuators, and MEMS II : 9-11 May 2005, Seville, Spain
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5836
Pub. Year:
2005
Page(from):
116
Page(to):
127
Pages:
12
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819458315 [0819458317]
Language:
English
Call no.:
P63600/5836
Type:
Conference Proceedings

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