DUV water immersion technology extends linearity: first results from the new 65nm node CD metrology system LWM500 WI

DUV water immersion technology extends linearity: first results from the new 65nm node CD metrology system LWM500 WI

Author(s):

Hillmann, F. ( MueTec GmbH (Germany) )

Dobereiner, S. ( MueTec GmbH (Germany) )

Gittinger, C. ( MueTec GmbH (Germany) )

Reiter, R. ( MueTec GmbH (Germany) )

Falk, G. ( MueTec GmbH (Germany) )

Bruck, H.-J. ( MueTec GmbH (Germany) )

Scheuring, G. ( MueTec GmbH (Germany) )

Bosser, A. ( Leica Microsystems Semiconductor GmbH (Germany) )

Heiden, M. ( Leica Microsystems Semiconductor GmbH (Germany) )

Hoppen, G. ( Leica Microsystems Semiconductor GmbH (Germany) )

Sulik, W. ( Leica Microsystems Semiconductor GmbH (Germany) )

Voilrath, W. ( Leica Microsystems Semiconductor GmbH (Germany) )

7 more

Publication title:

EMLC 2005 : 21st European Mask and Lithography Conference : 31 January-3 February, 2005, Dresden, Germany

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5835

Pub. Year:

2005

Page(from):

167

Page(to):

177

Pages:

11

Pub. info.:

Bellingham, Wash.,: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819458308 [0819458309]

Language:

English

Call no.:

P63600/5835

Type:

Conference Proceedings

Details

TDL ID:	ZA00015067
Series ID:	PA00000029
Conf. info. (Name):	EMLC : European Mask and Lithography Conference
Conf. info. (Number):	2005 : 21st
Conf. info. (Venue):	Dresden, Germany
Conf. info. (Date):	2005.01.31-2005.02.03

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