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High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)

Author(s):
Chang, G. -K. ( Georgia Institute of Technology (USA) )
Guidotti, D. ( Georgia Institute of Technology (USA) )
Huang, Z. R. ( Rensselaer Polytechnic Institute (USA) )
Wan, L. ( Georgia Institute of Technology (USA) )
Yu, J. ( Georgia Institute of Technology (USA) )
Hegde, S. ( Georgia Institute of Technology (USA) )
Kuo, H. -F. ( Georgia Institute of Technology (USA) )
Chang, Y, -J. ( Georgia Institute of Technology (USA) )
Liu, F. ( Georgia Institute of Technology (USA) )
Wang, F. ( Georgia Institute of Technology (USA) )
Tummala, R. ( Georgia Institute of Technology (USA) )
6 more
Publication title:
Enabling photonics technologies for defense, security, and aerospace applications : 31 March-1 April 2005, Orlando, Florida, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5814
Pub. Year:
2005
Page(from):
176
Page(to):
190
Pages:
15
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819457998 [081945799X]
Language:
English
Call no.:
P63600/5814
Type:
Conference Proceedings

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