Transfer bonding of thick silicon nitride film via split of porous silicon
- Author(s):
Bao, X. Q. ( East China Normal Univ. (China) ) Ding, Y. F. ( East China Normal Univ. (China) ) Chen, Y. ( East China Normal Univ. (China) ) Guo, P. S. ( East China Normal Univ. (China) ) Shi, Y. L. ( East China Normal Univ. (China) ) Wang, L. W. ( East China Normal Univ. (China) ) Lai, Z. S. ( East China Normal Univ. (China) ) - Publication title:
- Fifth International Conference on Thin Film Physics and Applications : 31 May-2 June, 2004, Shanghai, China
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5774
- Pub. Year:
- 2004
- Page(from):
- 579
- Page(to):
- 582
- Pages:
- 4
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819457554 [0819457558]
- Language:
- English
- Call no.:
- P63600/5774
- Type:
- Conference Proceedings
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