Elastic memory composites(EMC) for deployable industrial and commercial applications

Elastic memory composites(EMC) for deployable industrial and commercial applications

Author(s):

Arzberger, S. C. ( Composite Technology Development, Inc. (USA) )

Tupper, M. L. ( Composite Technology Development, Inc. (USA) )

Lake, M. S. ( Composite Technology Development, Inc. (USA) )

Barrett, R. ( Composite Technology Development, Inc. (USA) )

Mallick, K. ( Composite Technology Development, Inc. (USA) )

Hazelton, C. ( Composite Technology Development, Inc. (USA) )

Francis, W. ( Composite Technology Development, Inc. (USA) )

Keller, P. N. ( Composite Technology Development, Inc. (USA) )

Campbell, D. ( Composite Technology Development, Inc. (USA) )

Feucht, S. ( Composite Technology Development, Inc. (USA) )

Codell, D. ( Composite Technology Development, Inc. (USA) )

Wintergerst, J. ( Composite Technology Development, Inc. (USA) )

Adams, L. ( Composite Technology Development, Inc. (USA) )

Mallioux, J. ( Composite Technology Development, Inc. (USA) )

Denis, R. ( Composite Technology Development, Inc. (USA) )

White, K. ( Composite Technology Development, Inc. (USA) )

Long, M. ( Composite Technology Development, Inc. (USA) )

Munshi, N. A. ( Composite Technology Development, Inc. (USA) )

Gall, K. ( Univ. of Colorado/Boulder(USA) )

14 more

Publication title:

Smart structures and materials 2005 : Industrial and commercial applications of smart structures technologies : 7-10 March 2005, San Diego, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5762

Pub. Year:

2005

Page(from):

35

Page(to):

47

Pages:

13

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819457431 [0819457434]

Language:

English

Call no.:

P63600/5762

Type:

Conference Proceedings

Details

TDL ID:	ZA00014989
Series ID:	PA00000029
Conf. info. (Name):	Smart Structures and Materials
Conf. info. (Number):	2005
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	2005.03.07-2005.03.10

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