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New OPC methods to increase process margin for sub-70nm devices

Author(s):
  • Hong, J. -S. ( SAMSUNG Electronics Co. , Ltd. (South Korea) )
  • Kim, D. -H. ( SAMSUNG Electronics Co. , Ltd. (South Korea) )
  • Kim, S. -W. ( SAMSUNG Electronics Co. , Ltd. (South Korea) )
  • Yoo, M. -H. ( SAMSUNG Electronics Co. , Ltd. (South Korea) )
  • Kong, J. -T. ( SAMSUNG Electronics Co. , Ltd. (South Korea) )
Publication title:
Design and process integration for microelectronic manufacturing III : 3-4 March 2005, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5756
Pub. Year:
2005
Page(from):
302
Page(to):
312
Pages:
11
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819457363 [0819457361]
Language:
English
Call no.:
P63600/5756
Type:
Conference Proceedings

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