Building an infrastructure for parametric yield analysis: concept and implementation of a DFM platform(Invited Paper)
- Author(s):
Gookassian, J. ( HPL Technologies, Inc. (USA) ) Pack, B. ( HPL Technologies, Inc. (USA) ) Heins, M. ( HPL Technologies, Inc. (USA) ) Garcia, J. ( HPL Technologies, Inc. (USA) ) Divecha, H. ( HPL Technologies, Inc. (USA) ) Gordon, B. ( HPL Technologies, Inc. (USA) ) Frazier, D. ( HPL Technologies, Inc. (USA) ) White, D. ( HPL Technologies, Inc. (USA) ) Lachinyan, G. ( HPL Technologies, Inc. (USA) ) Dillon, B. ( HPL Technologies, Inc. (USA) ) Suzor, C. ( HPL Technologies, Inc. (USA) ) Adamov, A. ( HPL Technologies, Inc. (USA) ) Min, K. -Y. ( HPL Technologies, Inc. (USA) ) Bakarian, S. ( HPL Technologies, Inc. (USA) ) Marutyan, R. ( HPL Technologies, Inc. (USA) ) Boksha, V. ( HPL Technologies, Inc. (USA) ) - Publication title:
- Design and process integration for microelectronic manufacturing III : 3-4 March 2005, San Jose, California, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5756
- Pub. Year:
- 2005
- Page(from):
- 208
- Page(to):
- 218
- Pages:
- 11
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819457363 [0819457361]
- Language:
- English
- Call no.:
- P63600/5756
- Type:
- Conference Proceedings
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