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Building an infrastructure for parametric yield analysis: concept and implementation of a DFM platform(Invited Paper)

Author(s):
Gookassian, J. ( HPL Technologies, Inc. (USA) )
Pack, B. ( HPL Technologies, Inc. (USA) )
Heins, M. ( HPL Technologies, Inc. (USA) )
Garcia, J. ( HPL Technologies, Inc. (USA) )
Divecha, H. ( HPL Technologies, Inc. (USA) )
Gordon, B. ( HPL Technologies, Inc. (USA) )
Frazier, D. ( HPL Technologies, Inc. (USA) )
White, D. ( HPL Technologies, Inc. (USA) )
Lachinyan, G. ( HPL Technologies, Inc. (USA) )
Dillon, B. ( HPL Technologies, Inc. (USA) )
Suzor, C. ( HPL Technologies, Inc. (USA) )
Adamov, A. ( HPL Technologies, Inc. (USA) )
Min, K. -Y. ( HPL Technologies, Inc. (USA) )
Bakarian, S. ( HPL Technologies, Inc. (USA) )
Marutyan, R. ( HPL Technologies, Inc. (USA) )
Boksha, V. ( HPL Technologies, Inc. (USA) )
11 more
Publication title:
Design and process integration for microelectronic manufacturing III : 3-4 March 2005, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5756
Pub. Year:
2005
Page(from):
208
Page(to):
218
Pages:
11
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819457363 [0819457361]
Language:
English
Call no.:
P63600/5756
Type:
Conference Proceedings

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