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Integrating DfM components into a cohesive design-to-silicon solution(Invited Paper)

Author(s):
Liebmann, L. ( IBM Systems and Technology Group(USA) )
Maynard, D. ( IBM Systems and Technology Group(USA) )
McCullen, K. ( IBM Systems and Technology Group(USA) )
Seong, N. ( IBM Systems and Technology Group(USA) )
Buturla, E. ( IBM Systems and Technology Group(USA) )
Lavin, M. ( IBM Research(USA) )
Hibbeler, J. ( IBM Research(USA) )
2 more
Publication title:
Design and process integration for microelectronic manufacturing III : 3-4 March 2005, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5756
Pub. Year:
2005
Page(from):
1
Page(to):
12
Pages:
12
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819457363 [0819457361]
Language:
English
Call no.:
P63600/5756
Type:
Conference Proceedings

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