Integrating DfM components into a cohesive design-to-silicon solution(Invited Paper)
- Author(s):
Liebmann, L. ( IBM Systems and Technology Group(USA) ) Maynard, D. ( IBM Systems and Technology Group(USA) ) McCullen, K. ( IBM Systems and Technology Group(USA) ) Seong, N. ( IBM Systems and Technology Group(USA) ) Buturla, E. ( IBM Systems and Technology Group(USA) ) Lavin, M. ( IBM Research(USA) ) Hibbeler, J. ( IBM Research(USA) ) - Publication title:
- Design and process integration for microelectronic manufacturing III : 3-4 March 2005, San Jose, California, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5756
- Pub. Year:
- 2005
- Page(from):
- 1
- Page(to):
- 12
- Pages:
- 12
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819457363 [0819457361]
- Language:
- English
- Call no.:
- P63600/5756
- Type:
- Conference Proceedings
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