Blank Cover Image

A novel contact hole shrink process for the 65-nm node and beyond

Author(s):
Kawai, A. ( Nagaoka Univ. of Technology (Japan) )
Ishikawa, A. ( Nagaoka Univ. of Technology (Japan) )
Niiyama, T. ( Nagaoka Univ. of Technology (Japan) )
Harumoto, M. ( Dainippon Screen Manufacturing Co., Ltd. (Japan) )
Tamada, O. ( Dainippon Screen Manufacturing Co., Ltd. (Japan) )
Sanada, M. ( Dainippon Screen Manufacturing Co., Ltd. (Japan) )
1 more
Publication title:
Advances in resist technology and processing XXII : 28 February-2 March, 2005, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5753(1)
Pub. Year:
2005
Pt.:
1
Page(from):
195
Page(to):
205
Pages:
11
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819457332 [0819457337]
Language:
English
Call no.:
P63600/5753-1
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Effect of post development process for resist roughness

Tamada, O., Sanada, M., Ishikawa, A., Niiyama, T., Kawai, A.

SPIE - The International Society of Optical Engineering
7 Conference Proceedings Line edge roughness reduction by plasma curing photoresists

Sanada, M., Tamada, O., Ishikawa, A., Kawai, A.

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Solid defects condensation during watermark formation for immersion lithography [6153-67]

Niiyama, T, Kawai, A, Hori, S, Harumoto, M, Tamada, O, Sanada, M

SPIE - The International Society of Optical Engineering
8 Conference Proceedings Mechanical strength of resist film analyzed by tip indentation method

Osamu Tamada, Masakazu Sanada, Atsushi Ishikawa, Takayoshi Niiyama, Akira Kawai

SPIE - The International Society of Optical Engineering
3 Conference Proceedings Adgesion and removal of micro bubbles for immersion lithgraphy [6153-65]

Kawai, A, Niiyama, T, Endo, H, Yamanaka, M, Ishikawa, A, Suzuki, K, Tamada, O, Sanada, M

SPIE - The International Society of Optical Engineering
9 Conference Proceedings A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond

M. O. de Beeck, J. Versluijs, Z. Tokei, S. Demuynck, J. D. Marneffe, W. Boullart, S. Vanhaelemeersch, H. Zhu, P. …

SPIE - The International Society of Optical Engineering
4 Conference Proceedings Short develop time process with novel develop application system

Sanada, M., Tamada, O., Harumoto, M.

SPIE - The International Society of Optical Engineering
10 Conference Proceedings Analysis for collapse behavior of resist pattern in short develop time process using atomic force microscope

Masakazu Sanada, Osamu Tamada, Atsushi Ishikawa, Akira Kawai

SPIE - The International Society of Optical Engineering
5 Conference Proceedings Adhesion and removal behavior of nanoscale bubble on resist film surface for immersion lithography

Akira Kawai, Atsushi Ishikawa, Takayoshi Niiyama, Masahiko Harumoto, Osamu Tamada, Masakazu Sanada

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Optimization of contact hole lithography for 65-nm node logic LSI [6154-147]

Setta Y, Futatsuya H, Sagisaka A, Chijimatsu T, Minami T, Sugimoto F, Ishikawa S, Asai S

SPIE - The International Society of Optical Engineering
6 Conference Proceedings Trap mechanism of micro buble in micro concave patterns [6153-66]

Kawai, A, Ariga, T, Hori, S, Harumoto, M, Tamada, O, Sanada, M

SPIE - The International Society of Optical Engineering
12 Conference Proceedings Contact and via hole mask design optimization for 65-nm technology node

Van Den Broeke, D., Shi, X., Socha, R., Laidig, T., Hollerbach, U., Wampler, K. E., Hsu, S., Chen, J. F., Corcoran, N. …

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12