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Low-loss thermally stable waveguide with 45°micromirrors fabricated by soft molding for fully embedded board-level optical interconnects

Author(s):
Wang, L. ( Univ. of Texas at Austin (USA) )
Wang, X. ( Univ. of Texas at Austin (USA) )
Choi, J. ( Univ. of Texas at Austin (USA) )
Hass, D. ( Sanmina-SCI Corp. (USA) )
Magera, J. ( Sanmina-SCI Corp. (USA) )
Chen, R.T. ( Univ. of Texas at Austin (USA) )
1 more
Publication title:
Photonics Packaging and Integration V
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5731
Pub. Year:
2005
Page(from):
87
Page(to):
93
Pages:
7
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819457059 [0819457051]
Language:
English
Call no.:
P63600/5731
Type:
Conference Proceedings

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