Progress toward board-level optical interconnect technology (Invited Paper)

Progress toward board-level optical interconnect technology (Invited Paper)

Author(s):

Moynihan, M.L. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Sicard, B. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Ho, T. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Little, L. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Pugliano, N. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Shelnut, J.G. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Zheng, H.B. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Knudsen, P. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Lundy, D. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Chiarotto, N. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Lustig, C. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

Allen, C. ( Rohm and Haas Electronic Materials, L.L.C. (USA) )

7 more

Publication title:

Photonics Packaging and Integration V

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5731

Pub. Year:

2005

Page(from):

50

Page(to):

62

Pages:

13

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819457059 [0819457051]

Language:

English

Call no.:

P63600/5731

Type:

Conference Proceedings

Details

TDL ID:	ZA00014947
Series ID:	PA00000029
Conf. info. (Name):	Photonics West - Optoelectronic Materials and Devices : Photonics Packaging and Integration
Conf. info. (Number):	2005 : 5th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2005.01.27

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