Design and fabrication of a polymer-based micron-scale semispherical vertical interconnecting structure for 3D photonic integrated circuit application

Design and fabrication of a polymer-based micron-scale semispherical vertical interconnecting structure for 3D photonic integrated circuit application

Author(s):

Lee, M.-W. ( Inha Univ. (South Korea) )

Choi, C.-H. ( Inha Univ. (South Korea) )

Jo, S.-B. ( Inha Univ. (South Korea) )

O, B.-H. ( Inha Univ. (South Korea) )

Lee, S.-G. ( Inha Univ. (South Korea) )

Park, S.-G. ( Inha Univ. (South Korea) )

Lee, E.-H. ( Inha Univ. (South Korea) )

2 more

Publication title:

Optoelectronic Integrated Circuits VII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5729

Pub. Year:

2005

Page(from):

139

Page(to):

146

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819457035 [0819457035]

Language:

English

Call no.:

P63600/5729

Type:

Conference Proceedings

Details

TDL ID:	ZA00014946
Series ID:	PA00000029
Conf. info. (Name):	Photonics West - Optoelectronic Materials and Devices : Optoelectronic Integrated Circuits
Conf. info. (Number):	2005 : 7th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2005.01.25-2005.01.27

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