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Low-temperature wafer-level gold thermocompression bonding: modeling of flatness deviations and associated process optimization for high yield and tough bonds

Author(s):
  • Stamoulis, K. ( Massachusetts Institute of Technology (USA) )
  • Tsau, C.H. ( Massachusetts Institute of Technology (USA) )
  • Spearing, S.M. ( Massachusetts Institute of Technology (USA) and Univ. of Southampton (United Kingdom) )
Publication title:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5716
Pub. Year:
2005
Page(from):
42
Page(to):
52
Pages:
11
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456908 [081945690X]
Language:
English
Call no.:
P63600/5716
Type:
Conference Proceedings

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